TEAOH-based developer solution
Product Name TEAOH-based developer solution |
CAS Number |
Molecular Formula |
Molecular Weight |
Product Appearance Colorless and transparent liquid |
Packaging Specifications 220 L drum, IBC |
Core Uses Photolithography development for LCD/OLED display panels, development of positive photoresist for semiconductors, silicon etching for MEMS devices, and alkaline cleaning of electronic components. |
Product Features Electronic-grade ultra-high purity, stable development rate, high selectivity, low surface tension, and good pattern fidelity. |
Product Name Stripper |
CAS Number |
Molecular Formula |
Molecular Weight |
Product Appearance Colorless to pale yellow transparent liquid |
Packaging Specifications 220 L drum, IBC |
Core Uses Photoresist stripping, polymer residue cleaning after dry etching, residue removal after metal wiring etching, and photoresist removal in semiconductor/display panel manufacturing. |
Product Features Electronic-grade ultra-high purity, high stripping efficiency, low corrosivity to metals and dielectric materials, and no harmful residues. |
Product Name Wafer cleaning agent |
CAS Number |
Molecular Formula |
Molecular Weight |
Product Appearance Colorless and transparent liquid |
Packaging Specifications 220 L drums, IBC |
Core Uses Removal of particles/metal ions/organic residues from semiconductor wafer surfaces; cleaning in various stages of chip manufacturing processes; MEMS device cleaning; photovoltaic wafer cleaning. |
Product Features Electronic-grade ultra-high purity, low surface tension, good wetting and spreading properties, and strong compatibility with substrate materials. |
Product Name Hydroxylamine-based electronic-grade cleaning agent |
CAS Number |
Molecular Formula |
Molecular Weight |
Product Appearance Colorless to pale yellow transparent liquid |
Packaging Specifications 220 L drums, IBC |
Core Uses Post-etching cleaning IC process, contaminants removal from wafer surfaces, cleaning of photoresist residue, and cleaning agents for advanced packaging processes. |
Product Features Electronic-grade ultra-high purity, with low corrosivity to metals such as Al and Cu, high cleaning efficiency, and environmentally friendly with no harmful residues. |